Circuposit™ 3000-1 from Dupont Dow Rhom Hass Company

Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
 

Key Properties

• Exceptional Interconnect Reliability
• Horizontal or vertical application
• Excellent bath stability and performance
• Reduced bath maintenance
• Reduction in solution volume growth
• Low-build or high-build deposition
   

酸性鍍(du)銅中間體(ti)相關鏈接(jiē)：

垂直連續(xù)電鍍（VCP）高TP值(zhí)酸性鍍銅(tóng)光澤劑用(yòng)電鍍中間(jiān)體💋： benxiaohai.cc/news/170.html
 

PCB/FPC用高TP值(zhi)VCP酸性鍍銅(tong)光亮劑中(zhong)間體産品(pǐn)介紹： benxiaohai.cc/news/30.html
 

2021年度(du)填孔鍍銅(tóng)——印刷線路(lù)闆（PCB，FPC）酸性填(tián)孔鍍銅中(zhōng)間體： benxiaohai.cc/news/283.html

 

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