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DSM帝斯(si)曼NeoRez R-985/R-986聚氨酯分散(san)體
産品說明:用(yong)于金屬面漆,罩(zhao)光清漆,手套塗(tú)料,皮革塗料;用(yong)❄️作含PVC或不含的(de)地闆面漆;與丙(bǐng)烯酸乳液一起(qǐ)用于塑膠塗料(liào)。
發布時間:
2025-12-13
Dow Electronic Materials Introduces New Metallization and Imaging Products for Printed Circuit Boards
Unique Technology Helps Create Smaller, More Sustainable, Less Expensive Consumer Electronics.
Copper Gleam™ HV-101 & HV-606 Electrolytic Copper
Copper Gleam™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.
Copper Gleam™ HS-200 Electrolytic Copper from Dupont Dow Rhom Hass Company
The Copper Gleam™ HS-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. Formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.
Circuposit™ 3000-1 from Dupont Dow Rhom Hass Company
Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
BondFilm工藝介紹
通常(chang)來說,BondFilm工藝會将(jiāng)銅微蝕刻至1.2 到(dao)1.5 µm的厚度,同時将(jiang)銅表面(200 - 300 A)轉化成(cheng)期望的有機-金(jin)屬結構。通過這(zhè)個工藝後👉,可見(jiàn)的結果便是形(xíng)成一個棕色的(de)均勻鍍層。雖然(ran)銅的蝕刻會随(suí)着🈚浸置時間而(er)不斷進行,但是(shì)實際上BondFilm粘附層(céng)的生長是受自(zi)我限制的🌐,在該(gai)層的🈚形成和溶(róng)解🌍達到平衡後(hòu),就會達到了一(yī)個最大厚🚶度。
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